Minimize tirne to market? Contain simple simplified language? Just include spec information? Focus 00 end product performance?

Author:Vogal Tutaur
Language:English (Spanish)
Published (Last):24 April 2006
PDF File Size:20.16 Mb
ePub File Size:5.81 Mb
Price:Free* [*Free Regsitration Required]

Minimize tirne to market? Contain simple simplified language? Just include spec information? Focus 00 end product performance? Inhibit innovation? Keep people out? Increase cycle time? Users are. Th e TAEC recommends the use of the latest revision. Standards allow manufacturers , customers , and suppliers to understand ane another better.

Standards allow manufacturers greater e:ffi ciencies when they can set up their processes to meet industry standards , allowing them to offer their customers lower costs IPC spends hundreds of thousands of dollars annually to support lPC's volunteers in the standards and publications development process. There are many rounds of drafts sent out for review and the comrnittees spend hundreds of hours in review and developmen t. If your company buys lPC standards and public.

For more information on membership in lPC , please visit www. It is not possible 10 in cJ ude all of those who assisted in the evolution of this standard. Foster Defense Acquisition Inc. Training Consulting and Trade A. Liu Yunji , Huawei Technologies Co. J 2 Heat Shrinkable Soldering Devices Historically, electronic assembly solderi ng standards contained a more comprehensive tutorial addressing principles and techniques.

The intent of this document is to rely on process control methodology to ensure consistent qu a1 ity levels during the manufacture of products. The user see 1. The product class should be stated documentation package. Celsius is used to express temperature. Weight is expressed in grams 1.

Text takes precedence over the figures. Not all process indicators specified by this standard are noted. It is the responsibi Ji ty of the manufacturer see 1. In the event of conflict between the requirements of this standard and an assembly drawing s ldocumentation that has not been user approved , this standard govems. The likelihood of criteria not aligning increases when different revisions are used together. The user customer has the responsibility to specify acceptance criteria.

If no criteria is specified , required , or cited , then best manufacturing practice applies. Insulating material needs to provide sufficient electrical isolation.

Unless otherwise specified the requireme nts of this standard are not imposed on the procure ment of co mmercial. Jf the assembly is manufactured by the same manu fac turer, the solder requiremen ts are as stated in the contract for the entire assembly Personnel Proticiency A lI instructors, operators, and inspcction person ne!

Supervised on-the-job training is acceptable unti! To provide for per sonnel safety, follow the applicable local and Federal Occupational , Safety and Health Regulations? The acceptance criteria shall [N1N] have user agreemen t. The external interconnect points e. The frequency of analysis should be determined on the basis of histo rical data , or monthly analyses.

Records co ntain ing the resu! Other Lead-free solder alloy contamination limits may be used upon agreement between user and vendor. Note 2: Not app! STD or equivalent. Solder paste shall [] also meet the requirements of 3. The material shall [D I] be cured 3. See Appendix A for guidelines on tool selec ti on and maintenance. For operator comfort and solderabil? Li ght ranges from 0 K enable users to distinguish various printed circuit assembly features and contaminates with increased clarity 4.

Follow the requirements of 4. Protection may be provided through a contro lIed heating process 4. Parts should be mounled such that part markings and reference designators are visib le see 9. AIJ leads shall [] have stress relief when the component is clip or adhesive mounted or otherwise constrained. Wires connected to terminals shall [AIP] have stress relie f. Adhesives , e. Component body 4.

Solder 2. Air 4. Once parts are mounted on printed boards, the unsoldered assembly shall [] be handled , transpOJ1ed e. After soldering operations have been perfonmed , lhe assembly shall [D I] be sufficienlly cooled so the solder is solidified prior to further handling 4.

The preheat temperature exposure shall not [] degrade printed boards , components , or soldering performance 4. If used , co ntrolled accelerated or slo wed ramp cooling shall [NI] be in accordance with documented procedures. Dross shall [NIN2D3] be removed from the solder bath in a manner that assures that dross does not contact the items being soldered.

Automatic or manual mcthods for dross removal are acceptable 4. The solder connections should have a genera Il y smooth appearance. Marks or scratches , e. These soldcr connections are acceptable Wetting ca nnot always be judged by surface appearance.

The wide range of solder alloys in use may exhibit from low ol near zero degree contact angles to nearly contact angles as typica l. Exposed basis metal shall not [D ID2D3] prevent the formation of an solder conn ecti on b. Fractured solder connecti ons b.

Disturbed solder connections C. Fails to comply with wetting criteria of 4. The design does not restri ct solder ft ow to any connection eleme nt on the solder destin ation side lands e.

Wires overlap fo r at leasl 3 conductor diameters and 3re approximately parallel b. The solder prefonn ring is centered over the splice fo llowing criteria shall c. Conductor contour is discernible. Sleeving covers wi re insulation 00 both ends of the spliced area by a minimum of I wire di ameter f. No conductor strands piercing the sleeving. Meltable sealing rin g does not interfere with formation of req uired solder connection i.

Insul ation shall not [DID2D3] have c uts, breaks, cracks , or splits b. See 6. Recommendations and requirements 00 wires used in high voltage applications are provided in 1. Wires will be fo rmed for attachment to solder terminals b. The solder shall [NID2D3] wet the tinned portion of the wire and sho uld penetrate to the inner strands of the wire Solder build-up or ici c1 es within the tinned wire area shall not [DID2D3] affect subsequent assembly steps Stranded wires shall not [DID2D3] be tinned when a.

Wires will be used in crimp terminations b. Wires wi ll be used in threaded fasteners c. The shank of the terminal shall not [DID2D3] be perforated nor split , cracked , or otherwise damaged to the extenr that oils , flux , inks , or other liquid substances utilized for processing the printed board can be entrapped within the mounting hole 5.

Minimum elec tri cal clearance shall [DID2D3] be maintained and the ftare diameter should no l exceed the diameter of the land see Figure 5. A printed foil land shall? Radial s plit 3 max 2. Shank 2. Terminal base 3. Rolled flange. AFigure Terminal Mounting - Electrical 1. Flat shoulder 3. Plated-through hole 4.

Flared flange 2. Conductor 6. Pe rcentage 01 solde r source side land area covered with wetted solde r 5.


J-STD-001E: Requirements for Soldered Electrical and Electronic Assemblies

Emerald Group Publishing Limited. Recognised worldwide as the sole industry-consensus standard for soldering processes and materials, IPC J-STDE encompasses advanced technologies and provides new and updated criteria for all three classes of construction as well as expanded support for lead-free manufacturing. The product of a four-and-a-half year revision process involving more than 3, meeting hours from dedicated volunteers in the USA, Asia and Europe as well as countless hours of industry-wide review through the consensus-building balloting process, IPC J-STDE contains new, expanded, updated and consolidated soldering criteria. In addition to the technical changes made to the standard, extensive enhancements were made to the organization of the document to improve ease of use and clarity. New and updated, full-colour illustrations facilitate further understanding.





Related Articles