IBM 7RF SOI PDF

All users must read the checking procedures and density requirements described in this document. If your design will be used for production, i. Leadfree C4 GF's flip chip bumping is subject to availability at additional cost. Advance notice required.

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All users must read the checking procedures and density requirements described in this document. If your design will be used for production, i.

Leadfree C4 GF's flip chip bumping is subject to availability at additional cost. Advance notice required. Supply voltages are 1. You may not submit a design containing any options or metals stack which are not listed here without prior arrangement with MOSIS. Other configurations are available for dedicated runs or on MPW runs at an additional cost.

While the process supports other metal stacks, we offer 4LM-AM by default on multi-project wafer runs.

Designs for GF runs must meet the GF fill requirements when submitted. Information vital to preparing and submitting a design for fabrication in this process has been posted to the MOSIS Secure Document Server All users must read the checking procedures and density requirements described in this document.

Design rules supported by this technology Only the GF design rules will be supported for this technology. Reticle Copies Stepped on Wafer approx. Does not include height of the bumps.

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Search for:. Single-chip solutions address the need for fully integrated multimedia functionality on low-cost handsets, providing entry-level users in emerging markets such as China, India and Latin America with affordable, power-efficient and high-performance mobile devices. Supporting this integration pathway is an array of IBM engineering and go-to-marketing services that will help clients solve challenges related to component design and manufacturing. The breakthrough technology in SOI can minimize insertion loss and maximize isolation to help avoid issues such as loss of signal or dropped calls, potentially enabling significant cost advantages to mobile handsets.

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